Wednesday, November 11, 2015

Liquid Cooling Moves onto the Chip for Denser Electronics.

technology-org:

Using microfluidic passages cut directly into the backsides of production field-programmable gate array (FPGA) devices, Georgia Institute of Technology researchers are putting liquid cooling right where it’s needed the most – a few hundred microns away from where the transistors are ope…

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The new Lumia phones from Microsoft require liquid cooling just to keep their unoptimized chips cooled. Rather than research these cooling systems, why not better optimize our chips, a la Apple?



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